Liang, Zhenxian : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (68)
Les plus populaires
Liste
- Liste
- Tableau

1

Embedded power: a 3-D MCM integration technology for IPEM packaging application

Zhenxian Liang, van Wyk, J.D., Lee, F.C.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2006

Langue:

english

Fichier:

PDF, 4.13 MB

english, 2006

2

Investigation of Si IGBT Operation at 200$\,{}^\circ$C for Traction Applications

Xu, Zhuxian, Li, Ming, Wang, Fei, Liang, Zhenxian

Journal:

IEEE Transactions on Power Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 1.36 MB

english, 2013

3

Technology trends toward a system-in-a-module in power electronics

Lee, F.C., van Wyk, J.D., Boroyevich, D., Guo-Quan Lu,, Zhenxian Liang,, Barbosa, P.

Journal:

IEEE Circuits and Systems Magazine

Année:

2002

Langue:

english

Fichier:

PDF, 657 KB

english, 2002

4

A High Temperature Silicon Carbide mosfet Power Module With Integrated Silicon-On-Insulator-Based Gate Drive

Wang, Zhiqiang, Shi, Xiaojie, Tolbert, Leon M., Wang, Fei Fred, Liang, Zhenxian, Costinett, Daniel, Blalock, Benjamin J.

Journal:

IEEE Transactions on Power Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 4.49 MB

english, 2015

5

Development of Advanced All-SiC Power Modules

Liang, Zhenxian, Ning, Puqi, Wang, Fred

Journal:

IEEE Transactions on Power Electronics

Année:

2014

Langue:

english

Fichier:

PDF, 1.47 MB

english, 2014

6

Development of Si IGBT Phase-Leg Modules for Operation at 200 °C in Hybrid Electric Vehicle Applications

Xu, Zhuxian, Jiang, Dong, Li, Ming, Ning, Puqi, Wang, Fei Fred, Liang, Zhenxian

Journal:

IEEE Transactions on Power Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 1.31 MB

english, 2013

7

Temperature Dependent Short Circuit Capability of Silicon Carbide (SiC) Power MOSFETs

Wang, Zhiqiang, Shi, Xiaojie, Tolbert, Leon, Wang, Fei, Liang, Zhenxian, Costinett, Daniel, Blalock, Benjamin

Journal:

IEEE Transactions on Power Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 3.51 MB

english, 2015

8

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules

Pang, Ying Feng, Scott, Elaine P., Liang, Zhenxian, van Wyk, J. D.

Année:

2005

Langue:

english

Fichier:

PDF, 736 KB

english, 2005

9

Internal Geometry Variation of LTCC Inductors to Improve Light-Load Efficiency of DC-DC Converters

Hui Fern Lim, M., van Wyk, J.D., Zhenxian Liang

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2009

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2009

10

[IEEE 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014 - Fort Worth, TX, USA (2014.03.16-2014.03.20)] 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014 - Impact of ringing on switching losses of wide band-gap devices in a phase-leg configuration

Zhang, Zheyu, Guo, Ben, Wang, Fred, Tolbert, Leon M., Blalock, Benjamin J., Liang, Zhenxian, Ning, Puqi

Année:

2014

Langue:

english

Fichier:

PDF, 2.02 MB

english, 2014

11

[IEEE 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014 - Fort Worth, TX, USA (2014.03.16-2014.03.20)] 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014 - Methodology for switching characterization evaluation of wide band-gap devices in a phase-leg configuration

Zhang, Zheyu, Guo, Ben, Wang, Fred, Tolbert, Leon M., Blalock, Benjamin J., Liang, Zhenxian, Ning, Puqi

Année:

2014

Langue:

english

Fichier:

PDF, 1.85 MB

english, 2014

12

[IEEE 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Raleigh, NC, USA (2012.09.15-2012.09.20)] 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Planar bond all: A new packaging technology for advanced automotive power modules

Liang, Zhenxian, Ning, Puqi, Wang, Fred, Marlino, Laura

Année:

2012

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2012

13

High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications

Yin, Jian, Liang, Zhenxian, van Wyk, Jacobus Daniel

Journal:

IEEE Transactions on Power Electronics

Année:

2007

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2007

14

[IEEE IWIPP 2000. International Workshop on Integrated Power Packaging - Waltham, MA, USA (14-15 July 2000)] IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) - Embedded power-a multilayer integration technology for packaging of IPEMs and PEBBs

Zhenxian Liang,, Lee, F.C., Lu, G.Q., Borojevic, D.

Année:

2000

Langue:

english

Fichier:

PDF, 392 KB

english, 2000

15

[IEEE 2011 IEEE Energy Conversion Congress and Exposition (ECCE) - Phoenix, AZ, USA (2011.09.17-2011.09.22)] 2011 IEEE Energy Conversion Congress and Exposition - Investigation of Si IGBT operation at 200 °C for traction application

Xu, Zhuxian, Li, Ming, Wang, Fred, Liang, Zhenxian

Année:

2011

Langue:

english

Fichier:

PDF, 853 KB

english, 2011

16

[IEEE 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, PA, USA (2014.9.14-2014.9.18)] 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - All-SiC power module for delta-type current source rectifier

Guo, Ben, Wang, Fred, Aeloiza, Eddy, Ning, Puqi, Liang, Zhenxian

Année:

2014

Langue:

english

Fichier:

PDF, 1.01 MB

english, 2014

17

[IEEE 2013 IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Columbus, OH, USA (2013.10.27-2013.10.29)] The 1st IEEE Workshop on Wide Bandgap Power Devices and Applications - Fabrication and evaluation of a high performance SiC inverter for wireless power transfer applications

Onar, Omer C., Campbell, Steven, Ning, Puqi, Miller, John M., Liang, Zhenxian

Année:

2013

Langue:

english

Fichier:

PDF, 3.87 MB

english, 2013

18

[IEEE 2013 IEEE Energy Conversion Congress and Exposition (ECCE) - Denver, CO, USA (2013.09.15-2013.09.19)] 2013 IEEE Energy Conversion Congress and Exposition - Advanced packaging of SiC power module for automotive applications

Liang, Zhenxian, Ning, Puqi, Wang, Fred

Année:

2013

Langue:

english

Fichier:

PDF, 2.89 MB

english, 2013

19

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Liang, Zhenxian, Ning, Puqi, Wang, Fred, Marlino, Laura

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Année:

2014

Langue:

english

Fichier:

PDF, 2.36 MB

english, 2014

20

Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications

Lim, Michele Hui Fern, Liang, Zhenxian, van Wyk, Jacobus Daniel

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2007

Langue:

english

Fichier:

PDF, 955 KB

english, 2007

21

[IEEE 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, PA, USA (2014.9.14-2014.9.18)] 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - A high temperature silicon carbide MOSFET power module with integrated silicon-on-insulator based gate drive

Wang, Zhiqiang, Shi, Xiaojie, Tolbert, Leon M., Wang, Fred, Liang, Zhenxian, Costinett, Daniel, Blalock, Benjamin J.

Année:

2014

Langue:

english

Fichier:

PDF, 3.25 MB

english, 2014

22

Power Module and Cooling System Thermal Performance Evaluation for HEV Application

Puqi Ning,, Zhenxian Liang,, Wang, Fred

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Année:

2014

Langue:

english

Fichier:

PDF, 1.62 MB

english, 2014

23

[IEEE APEC 2005. Twentieth Annual IEEE Applied Power Electronics Conference and Exposition - Austin, TX, USA (6-10 March 2005)] Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005. - High temperature embedded power module

han Yin,, Zhenxian Liang,, van Wyk, J.D.

Année:

2005

Langue:

english

Fichier:

PDF, 844 KB

english, 2005

24

[IEEE 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Raleigh, NC, USA (2016.6.13-2016.6.15)] 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Parasitic inductance extraction and verification for 3D Planar Bond All Module

Fei Yang,, Liang, Zhenxian, Zhiqiang Wang,, Wang, Fred

Année:

2016

Langue:

english

Fichier:

PDF, 3.42 MB

english, 2016

25

Preharvest ZnSO 4 spray improves the storability of longan ( Dimocarpus longan Lour.) fruits by protecting the cell wall components and antioxidants of pericarp

Luo, Tao, Niu, Jiajia, Guo, Xiaomeng, Wu, Huitao, Han, Dongmei, Shuai, Liang, Wu, Zhenxian

Journal:

Journal of the Science of Food and Agriculture

Année:

2018

Langue:

english

Fichier:

PDF, 1.53 MB

english, 2018

26

Electrical Performance Advancement in SiC Power Module Package Design with Kelvin Drain Connection and Low Parasitic Inductance

Yang, Fei, Wang, Zhiqiang, Liang, Zhenxian, Wang, Fred

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Année:

2018

Langue:

english

Fichier:

PDF, 2.55 MB

english, 2018

27

Deep level defects in si-implanted lec undoped Si−GaAs

Liang Zhenxian, Luo Jinsheng

Journal:

Journal of Electronics (China)

Année:

1991

Langue:

english

Fichier:

PDF, 323 KB

english, 1991

28

[IEEE Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting - Tampa, FL (2006.10.8-2006.10.8)] Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting - Effect of geometry variation of LTCC distributed air-gap filter inductor on light load efficiency of DC-DC converters

Lim, Michele, Van Wyk, J., Liang, Zhenxian

Année:

2006

Langue:

english

Fichier:

PDF, 7.18 MB

english, 2006

29

Multiplex quantification of 16S rDNA of predominant bacteria group within human fecal samples by polymerase chain reaction – ligase detection reaction (PCR-LDR)

Kai Li, Bei Chen, Yuxun Zhou, Rui Huang, Yinming Liang, Qinxi Wang, Zhenxian Xiao, Junhua Xiao

Journal:

Journal of Microbiological Methods

Année:

2009

Langue:

english

Fichier:

PDF, 539 KB

english, 2009

30

A study of thermal stress and intrinsic residual stress in planar metallization for integrated power modules

Ning Zhu, van Wyk, J.D., Zhenxian Liang, Odendaal, W.G.H.

Journal:

IEEE Transactions on Industry Applications

Année:

2005

Langue:

english

Fichier:

PDF, 756 KB

english, 2005

31

Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Packaging

Charboneau, B.C., Fei Wang, van Wyk, J.D., Boroyevich, D., Zhenxian Liang, Scott, E.P., Tipton, C.W.

Journal:

IEEE Transactions on Industry Applications

Année:

2008

Langue:

english

Fichier:

PDF, 1.78 MB

english, 2008

32

Selective collection and detection of MCF-7 breast cancer cells using aptamer-functionalized magnetic beads and quantum dots based nano-bio-probes

Hua, Xin, Zhou, Zhenxian, Yuan, Liang, Liu, Songqin

Journal:

Analytica Chimica Acta

Année:

2013

Langue:

english

Fichier:

PDF, 1.16 MB

english, 2013

33

[IEEE IECON'03. 29th Annual Conference of the IEEE Industrial Electronics Society - Roanoke, VA, USA (2-6 Nov. 2003)] IECON'03. 29th Annual Conference of the IEEE Industrial Electronics Society (IEEE Cat. No.03CH37468) - A future approach to integration in power electronics systems

van Wyk, J.D., Lee, F.C., Boroyevich, D., Zhenxian Liang,, Kaiwei Yao,

Année:

2003

Langue:

english

Fichier:

PDF, 1.01 MB

english, 2003

34

[IEEE 2012 24th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Bruges, Belgium (2012.06.3-2012.06.7)] 2012 24th International Symposium on Power Semiconductor Devices and ICs - Status and trend of automotive power packaging

Liang, Zhenxian

Année:

2012

Langue:

english

Fichier:

PDF, 2.06 MB

english, 2012

35

[IEEE Conference Record of the 2003 IEEE Industry Applications Conference. 38th IAS Annual Meeting - Salt Lake City, UT, USA (12-16 Oct. 2003)] 38th IAS Annual Meeting on Conference Record of the Industry Applications Conference, 2003. - Comparison of transient thermal parameters for different die connecting approaches

Jian Yin,, van Wyk, J.D., Odendaal, W.G., Zhenxian Liang,

Année:

2003

Langue:

english

Fichier:

PDF, 766 KB

english, 2003

36

[IEEE 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012 - Orlando, FL, USA (2012.02.5-2012.02.9)] 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Si IGBT phase-leg module packaging and cooling design for operation at 200 °C in hybrid electrical vehicle applications

Xu, Zhuxian, Jiang, Dong, Li, Ming, Ning, Puqi, Wang, Fred, Liang, Zhenxian

Année:

2012

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2012

37

[IEEE 5th International Conference on Properties and Applications of Dielectric Materials - Seoul, South Korea (25-30 May 1997)] Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials - Electrooptical modulation characteristics of charge-addressed ferroelectric crystal spatial light modulators

Liang Zhenxian,

Année:

1997

Langue:

english

Fichier:

PDF, 221 KB

english, 1997

38

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Thermal performance of a power electronics module made by thick-film planar interconnection of power devices

Wen, S.S., Zhenxian Liang,, Lee, F.C., Guo-Quan Lu,

Année:

2002

Langue:

english

Fichier:

PDF, 625 KB

english, 2002

39

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Planar metallization intemonnected 3-D multi-chip module

Zhenxian Liang,, van Wyk, J.D.

Année:

2003

Langue:

english

Fichier:

PDF, 599 KB

english, 2003

40

[IEEE 2013 IEEE Applied Power Electronics Conference and Exposition - APEC 2013 - Long Beach, CA, USA (2013.03.17-2013.03.21)] 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Double-sided cooling design for novel planar module

Ning, Puqi, Liang, Zhenxian, Wang, Fei

Année:

2013

Langue:

english

Fichier:

PDF, 992 KB

english, 2013

41

[IEEE 5th International Conference on Properties and Applications of Dielectric Materials - Seoul, South Korea (25-30 May 1997)] Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials - Insulation protection of high-power GaAs photoconductive switch

Shi Wei,, Liang Zhenxian,, Feng Jun,, Xu Chuanxiang,

Année:

1997

Langue:

english

Fichier:

PDF, 254 KB

english, 1997

42

[IEEE 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012 - Orlando, FL, USA (2012.02.5-2012.02.9)] 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Power module and cooling system thermal performance evaluation for HEV application

Ning, Puqi, Liang, Zhenxian, Wang, Fred, Marlino, Laura

Année:

2012

Langue:

english

Fichier:

PDF, 758 KB

english, 2012

43

[IEEE Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting. - Seattle, WA, USA (3-7 Oct. 2004)] Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting. - A chip-level process for power switching module integration and packaging

Zhenxian Liang,, van Wyk, J.D., Lee, F.C.

Année:

2004

Langue:

english

Fichier:

PDF, 1.14 MB

english, 2004

44

Hepatitis E Virus Genotype 4, Nanjing, China, 2001–2011

Dai, Xing, Dong, Chen, Zhou, Zhenxian, Liang, Jiuhong, Dong, Min, Yang, Yan, Fu, Jianguang, Tian, Hua, Wang, Song, Fan, Jie, Meng, Jihong, Purdy, Michael A.

Journal:

Emerging Infectious Diseases

Année:

2013

Langue:

english

Fichier:

PDF, 359 KB

english, 2013

45

[IEEE APEC 2005. Twentieth Annual IEEE Applied Power Electronics Conference and Exposition - Austin, TX, USA (6-10 March 2005)] Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005. - Design of an embedded Bi-planar coil-based integrated current sensor for power module integration

Jing Xu,, Lingyin Zhao,, Zhenxian. Liang,, van Wyk, J.D.

Année:

2005

Langue:

english

Fichier:

PDF, 833 KB

english, 2005

46

Increasing the southern side-slope albedo remedies thermal asymmetry of cold-region roadway embankments

Qin, Yinghong, Liang, Jia, Luo, Zhenxian, Tan, Kanghao, Zhu, Zhen

Journal:

Cold Regions Science and Technology

Année:

2016

Langue:

english

Fichier:

PDF, 734 KB

english, 2016

47

[IEEE APEC 2005. Twentieth Annual IEEE Applied Power Electronics Conference and Exposition - Austin, TX, USA (6-10 March 2005)] Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005. - Functional integration in active IPEM by using a planar integration technology

Zhenxian Liang,, van Wyk, J.D.

Année:

2005

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2005

48

[IEEE 2014 IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Knoxville, TN, USA (2014.10.13-2014.10.15)] 2014 IEEE Workshop on Wide Bandgap Power Devices and Applications - Development of packaging technologies for advanced SiC power modules

Liang, Zhenxian, Wang, Fred, Tolbert, Leon

Année:

2014

Langue:

english

Fichier:

PDF, 1.51 MB

english, 2014

49

[IEEE 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Chicago, IL, USA (2015.5.3-2015.5.6)] 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Advanced packaging technologies for fully exploiting attributes of WBG power electronics

Liang, Zhenxian

Année:

2015

Langue:

english

Fichier:

PDF, 4.04 MB

english, 2015

50

[IEEE Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting. - Seattle, WA, USA (3-7 Oct. 2004)] Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting. - Design and optimization of embedded power chip modules for double-sided cooling

Jian Yin,, van Wyk, J.D., Odendaal, W.G., Zhenxian Liang,

Année:

2004

Langue:

english

Fichier:

PDF, 617 KB

english, 2004